Samsung has today said that it
has started production of chips Epop (embedded package on package) first in the
world. This is a 3 in 1 chip, including LPDDR3 DRAM capacity 3GB, eMMC 32GB (used
for memory) and a controller. It will be used in high-end mobile devices, specifically
smartphones and tablets. Benefits of using Epop chip that is very thin (1.4 mm)
and enclosed in a single package (15 x 15mm), so manufacturers can apply it to
her husband on the processor, thereby saving area of more than 40% compared
with having to use two separate chip package today.
Talk about performance, 3GB
of RAM LPDDR3 Epop chip can operate with data transfer speeds up to 1866Mbps; it
also supports bandwidth I / O 64-bit. It also possesses the characteristics
against heat to maintain good performance in the long run. Samsung said in the
coming years it will continue research to develop memory Epop line with higher
capacity, better performance to meet the needs of the market.
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